| Title |
Development of High Aspect Ratio Spacer Process using Anodic Bonding for FED |
| Authors |
김민수(Kim, Min-Su) ; 김관수(Kim, Gwan-Su) ; 문권진(Mun, Gwon-Jin) ; 우광제(U, Gwang-Je) ; 이남양(Lee, Nam-Yang) ; 박세광(Park, Se-Gwang) |
| Keywords |
FED ; Spacer ; Anodic bonding ; Spacer holder ; Al line |
| Abstract |
In this paper, a spacer process for FED(Field Emission Display) was developed with the glass to glass anodic bonding technology using Al film as an interlayer and a 3.5 inch monochromatic type FED was fabricated. Holder to dislocate spacers vertically was designed with (110) Si wafer by bulk etching. Spacers, 100μm width and 1000μm height, were formed on anode panel by spacer to glass anodic bonding and the fabricated FED was operated for emission at 1㎸ anode voltage. |