| Title |
Degradation Behavior and Resistivity Changes After Thermal Aging of Matte Tin-Plated Copper Sheet for Current Collector in Fuel Cell |
| Authors |
김주한(Kim, Ju-Han) ; 김재훈(Kim, Jae-Hun) ; 구경완(Koo, Kyung-Wan) ; 금영범(Keum, Young-Bum) ; 정귀성(Jeong, Kwi-Seong) ; 고행진(Ko, Haeng-Jin) ; 한상옥(Han, Sang-Ok) |
| Keywords |
Current Collector ; Tin-plate ; Thermal Aging ; Intermetallic ; Resistivity |
| Abstract |
Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, Cu6Sn5(μ) and Cu3Sn(ε) intermetallics layer were formed at plate/substrate interface. Cu6Sn5(μ) intermetallics layer gradually changed Cu3Sn(ε). Moreover Cu get through Sn layer and it was diffused in the surface at 200°C. On the other hand, only Cu3Sn(ε) intermetallics layer were formed at plate/substrate interface at 300°C. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet. |