| Title |
Wireless Power Receiving System Implemented on a Flexible Substrate for Wearable Device Applications |
| Authors |
이용완(Lee, Yongwan) ; 임종식(Lim, Jongsik) ; 한상민(Han, Sang-Min) |
| DOI |
https://doi.org/10.5370/KIEE.2015.64.5.739 |
| Keywords |
Wireless Power Transfer ; Rectennas ; Flexible substrates ; Wearable devices ; Defected Ground Structures (DGSs) |
| Abstract |
In this paper, a flexible wireless power receiving system is proposed for wearable device applications. The proposed system is designed with printable component configuration to be integrable to textile material. While the defected ground structures(DGSs) are utilized for planar printable filter designs, direct impedance matching technique is considered for flexible circuit performance. The proposed system has been implemented on a flexible substrate with a thickness of 5 mils, and experimented for power conversion efficiencies and converted voltages. In order to evaluate the hardware flexibility, the system performance are measured a bended circuit board at a radius of curvature of 5 cm. The system performance is analyzed for the degradation due to the curvature. The proposed system has shown the excellent capability of far-field wireless power transfer systems in flexible device environments. |