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References

1 
C. Zhang, S. Liu, S. Li, Y. Ma, W. Lu, J. Huang, W. Sun, Z. Yang, Y. Zhu, L. Ni, May 2022, Investigation on the Degradation Mechanism for GaN Cascode Device Under Repetitive Hard-Switching Stress, IEEE Trans. Power Electron., Vol. 37, No. 5, pp. 6009-6017DOI
2 
C. Xu, F. Yang, E. Uger, S. Pu, B. Akin, Dec 2018, Performance degradation of GaN HEMTs under accelerated power cycling tests, CPSS Trans. Power Electron. Appl., Vol. 3, No. 4, pp. 269-277DOI
3 
P. Xue, L. Maresca, M. Riccio, G. Breglio, A. Irace, Jun 2020, Investigation on the short-circuit oscillation of cascode GaN HEMTs, IEEE Trans. Power Electron., Vol. 35, No. 6, pp. 6292-6300DOI
4 
S. Dalcanale, M. Meneghini, A. Tajalli, I. Rossetto, M. Ruzzarin, E. Zanoni, G. Meneghesso, 2017, GaN-based MIS- HEMTs: Impact of cascodemode high temperature source current stress on NBTI shift, IEEE International Reliability Physics Symposium (IRPS), pp. 4B-1.1-4B-1.5DOI
5 
M. Farhadi, F. Yang, S. Pu, B. T. Vankayalapati, B. Akin, Jul 2021, Temperature-independent gate-oxide degradation monitoring of SiC MOSFETs based on junction capacitances, IEEE Trans. Power Electron., Vol. 36, No. 7, pp. 8308-8324DOI
6 
L. Yang, A. Castellazzi, Jul 2013, High temperature gate-bias and reverse-bias tests on SiC MOSFETs, Microelecton. Rel., Vol. 53, No. 9-11, pp. 1771-1773DOI
7 
U. Karki, N. S. Gonzalez-Santini, F. Z. Peng, Jun 2020, Effect of gate-oxide degradation on electrical parameters of silicon carbide MOSFETs, IEEE Trans. Electron Devices, Vol. 67, No. 6, pp. 2544-2552DOI
8 
F. Yang, S. Pu, C. Akin, B. Xu, Feb 2021, Turn-on delay based real-time junction temperature measurement for SiC MOSFETs with aging compensation, IEEE Trans. Power Electron., Vol. 36, No. 2, pp. 1280-1294DOI
9 
Z. Zhang, J. Dyer, X. Wu, F. Wang, D. Costinett, L. M. Tolbert, B. J. Blalock, Aug 2019, Online junction temperature monitoring using intelligent gate drive for SiC power devices, IEEE Trans. Power Electron., Vol. 34, No. 8, pp. 7922-7932DOI